FEATURES
l Small Size, Less Space, Convenient to Move, Easy Operation ＆ Maintenance
l Perfect Software Progress Analysis Function ＆ Practicality
l High Performance
l Suitable for High-speed Sampling and General Inspection of BGA
l 360°Rotation Fixture Enable Comprehensive Inspection
APPLICATION
l Defects In Conventional Process of BGA And other Components
l Connector
l Inner Inspection of Small Components
l Bottom Solder of High-power Parts
l Flexible PCB Soldering Inspection
SPECIFICATIONS
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MACHINE
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DEMENTION
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680(W)×720(D)×580(H)
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WEIGHT
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200KG
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POWER SUPPLY
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220VC/50Hz
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MAX POWER
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0.3KW
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TUBE
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TYPE
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CLOSED TUBE
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VOLTAGE
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80KV
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CURRENT
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500uA
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CURRENT
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22μm
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DETECTOR
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FOCUS SIZE
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15-25×
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WINDOW
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φ16-φ25mm
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RESOLUTION
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16Lp/mm
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WORKSTATION
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SIZE
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200mm×180mm
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INSPECTION AREA
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190mm×170mm
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360°Rotation Fixture
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CONTROL MODE
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Manually Workstation Control X&Y Axis Movement
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SATETY
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<1μSv/h
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SOFTWARE FEATURES
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SODERING DEFECT ANALYSIS
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Real-time software analysis can clearly determine the internal components of impurities, cracks, BGA bridging, multi-soldering, lack of solder, off set and other common solder defects
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MENSUREMENT CALCULATION
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Point to point distance measurement, solder ball diameter measurement, inner void measurement of the conventional BGA
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ASSISTED FUNCTION
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Simulated 3D, multi-color rendering analysis, contour extraction, anti-color view
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X-RAY
